Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
The Truth Behind the 30% Surge in FPC Lead-Free Failure Rates | The “Invisible Killer” of Consumer Electronics
Release date: 2025-08-08 00:00
Share to:

A FPC found that some locations appear shallow phenomenon, NG samples on the side and in the middle of the shallow phenomenon, the next article will be through the systematic failure analysis, aimed at finding the root cause of the FPC shallow.

1. Optical analysis

The shallow and normal position of the NG sample marked by the shallow and normal position of the NG sample are analyzed to be shallow on the left and middle of the NG sample.

Image

2. morphological analysis

Open the FPC gold finger and glass surface, the shallow position for observation found that the ACF glue mainly residue in the glass surface, FPC edge, gold finger and gold finger between the denser particles, FPC surface has more black spots, glass surface ACF adhesive surface has more density of larger particles.

Conductive particles obvious area ACF glued to the FPC surface and glass surface, FPC surface no obvious black point, glass surface no obvious scattered particles.

Image

Image

Image


3. Sliced analysis

The shallow position and normal position of the NG sample are observed: there is a layer of material on the surface of the FPC in the shallow position, the two sides of the FPC are more serious, and the area with thicker edge foreign objects has a layered phenomenon. There is no obvious substance on the surface of the FPC in the normal position.

Image

4. Elemental analysis

For elemental analysis of the shallow position of the NG sample sample, the ACF glue surface particles contain Ni, Cu, Cl and other elements; the slicing FPC surface material mainly contains Ni, Cu, Au, O, Cl and other elements, mainly Ni, Cu corrosion products.

Image

5. FTIR analysis

From the infrared spectator, it can be seen that the NG sample sample shallow position and normal position, both of which are polyurethane, of which 3410~3435cm-1 belongs to the N-H telescopic vibration absorption peak of polyurethane; 1725~1735cm-1 belongs to the C=O telescopic vibration absorption peak in polyurethane; the two absorb peak position and strength are not significantly different, and there is no obvious difference in curing degree as shown in Figure 6-1.

Image


6. Analysis and Summary

Sample of NG:

From the morphological analysis and slicing results, it can be seen that the light position, the ACF glue is mainly glued to the glass surface, and the normal position ACF glue is glued to both the FPC and the glass surface; the shallow side position FPC is more dense particles (BSE backscatter mode, the greater the density, the whiter the color), and most of the elements embedded in the glue interior, combined with the elements analysis results, the main elements of the particles are Ni, Cu, Cl, O, K and other elements.

The mechanism of nickel and copper corrosion caused by Cl ions is mostly electrochemical corrosion, which is caused by pitting, producing nickel oxide, nickel hydroxide, copper oxide and so on.


In summary, the following conclusions can be drawn:

The reason for the shallow FPC is that the FPC is corroded by the Cl element, and the corrosion product overflows to the surface and inside of the glue, causing shallow phenomena.


Good public service in August.

"In this article, the FPC shallow phenomenon belongs to

What kind of polymer material fails?”

A Corrosion failure B Wear failure C Thermal aging failure


在Share your answers

We will select three fans on August 18th.

Give the following gift (one choice) 1!


Image


Failure analysis case book                               Beautiful wireless mouse



Relevant cases
Still failing despite meeting IPC standards? The OSP film thickness tolerance vulnerability overlooked by 90% of factories
After undergoing two reflow temperatures, OSP pads exhibited severe solderability issues during wave soldering. Reducing the reflow temperature resolved the solderability problems. This paper analyzes the failure causes and mechanisms of solderability defects on OSP pads and proposes improvement recommendations.
Silicone Exceeding Limits = EU Sales Ban? With Global Regulations Tightening, Is Your Product Compliant?
Siloxanes are a class of organosilicon compounds containing Si-O-Si bonds, widely used in rubber, detergents, polishes, adhesives, sealants, and other fields. Due to the environmental and health risks associated with certain siloxanes, numerous countries and regions worldwide have enacted regulations to control their use.
Save Millions! Practical Tips for Avoiding Pitfalls in Metal Material Selection (Part 2)
In the previous article, “Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Material Selection for Electronics (Part 1),” we established a knowledge framework for metal material properties and applications, and outlined the core steps for scientific material selection. However, theory must be tested by practice. This article will focus on the practical aspects: How can advanced inspection technologies provide reliable data support for material selection decisions? How can performance and cost be skillfully balanced in projects? Real-world case studies will reveal the consequences of improper material selection and the solutions to address them.
Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Selection for Electronics (Part 1)
In electronic products, the selection of metal components directly impacts product performance, safety, and lifespan. From smartphone casings to aircraft engine blades, the scientific selection of metal materials stands as a core element in technological R&D. This article will explore the cost-effectiveness considerations in metal material selection in two parts, integrating laboratory testing techniques with engineering practice.
Flux compatibility issues with PCBA can actually lead to such severe consequences?!
A PCBA board for an audio product (using wave soldering) suffered burnout during operation. When using flux variant A, failure rates were high; after cleaning, the rate decreased slightly. Switching to flux variant B reduced the defect rate to zero. This paper will employ a series of professional testing and analytical methods to identify the root cause of the failure.
Rigorous Testing! Can Your Phone Handle These Challenges?
In today's era of widespread smartphone adoption, device reliability has become a key concern for users. A highly reliable phone not only delivers a smooth user experience but also remains dependable when it matters most. So, what factors influence smartphone reliability, and how can it be improved? Today, let's delve into these questions.
Online Customer Service
Business Consultation
Free Consultation
Report Inquiry
Back to Top
Contact Us
  • *Name:
  • *Contact:
  • *Email:
  • *Company/Organization/school:
  • *The location:
  • *Message information: