Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Rigorous Testing! Can Your Phone Handle These Challenges?
Release date: 2025-06-25 00:00
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In today's popularization of smart phones, mobile phone reliability has become the focus of user attention. A high-reliability mobile phone can not only bring a smooth experience, but also do not fall off the chain at a critical moment. So, what factors affect the reliability of mobile phones? How to upgrade? Today, let’s take a closer look at it.


History of mobile phone development

From simulation to intelligent leap

The development of mobile phones can be said to be the evolution of a communication technology. From the big brother of  to the 5G mobile phone that now integrates ultra-high-speed transmission, ultra-low latency, and large-scale connectivity, every technological innovation has brought about a huge change in mobile phones. Big Brother can only carry out voice business, and in the 2G era, mobile phones began to support SMS, MMS, and even can handle mail and web pages. In the 3G era, the combination of mobile phones and the Internet is more closely, and multimedia forms have begun to enrich. In the 4G era, the network connection is faster and more stable, and the rise of APP has made mobile phone functions more diverse. In the 5G era, the deep integration of artificial intelligence technology with mobile phone hardware and software has made mobile phones have unprecedented intelligence, convenience and personalization capabilities.

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Cell Phone Structure and Function

Precision and Diversity Integration

A mobile phone, seemingly simple, but the internal structure is complex. From motherboards to batteries, from displays to cameras, every component is carefully designed and manufactured. The function of the mobile phone covers many aspects such as calling, surfing the Internet, taking photos, and entertainment. Today, with the continuous advancement of technology, the functions of mobile phones are still expanding, such as health monitoring, mobile payment, etc., to make our lives more convenient.

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Mobile phone reliability test project

Rigorous and comprehensive testing

The reliability of mobile phones is affected by a variety of factors, which are carried out throughout the entire process of mobile phone research and development, production and use.

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From the research and development stage, design defects are one of the important factors affecting the reliability of mobile phones. For example, the heat dissipation design is unreasonable, which will cause the mobile phone to run for a long time or be in a high temperature environment, and the heat cannot be dissipated in time, resulting in a decline in the performance of the mobile phone, and even a crash, restart and other issues. The structural design is not reasonable, which may affect the assembly accuracy of the mobile phone and the stability of the internal components, and increase the risk of failure of the mobile phone.


In the production process, hardware quality is the key. The chip, as the "brain" of the mobile phone, the quality directly determines the speed and stability of the mobile phone. If a low-quality chip is used, it may cause the mobile phone to run stutter and crash frequently. In addition, the quality of electronic components such as capacitors, resistance, etc. can not be ignored, and the instability or poor quality of their parameters may affect the normal work of the circuit, which in turn leads to the failure of the mobile phone.


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The use of the environment also has an important impact on the reliability of mobile phones. In terms of temperature, in a high temperature environment, the performance of the mobile phone battery will decrease, the battery life will be shortened, and the performance of electronic components may also be affected, accelerating aging; in a low temperature environment, the discharge capacity of the battery will be reduced, which may lead to the automatic shutdown of the mobile phone. In terms of humidity, the high humidity environment will make electronic components damp, causing short circuits and other problems; low humidity environment may produce static electricity, causing damage to mobile phones. In addition, dust and vibration is also a factor that can not be ignored, dust into the inside of the mobile phone may affect the heat dissipation and the normal work of the circuit, and vibration may lead to loose and fall off internal components of the mobile phone, causing poor contact.


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What are mobile phone reliability improvement strategies?

In response to the above factors that affect the reliability of mobile phones, we can adopt the following strategies to improve the reliability of mobile phones.


在In the research and development stage, we should pay attention to optimizing the design. Strengthen the heat dissipation design, the use of efficient heat dissipation materials and heat dissipation structure, such as heat sinks, heat pipes, etc., to ensure that the mobile phone can maintain good heat dissipation performance in various environments. At the same time, improve the structural design, improve the assembly accuracy of the mobile phone and the stability of internal components, and facilitate subsequent maintenance and upgrading.


In the production process, the quality of the hardware should be strictly controlled. Choose high-quality chip and electronic components suppliers to conduct rigorous inspection and testing of raw materials to ensure that they meet high standards. In the production process, increase multiple inspection processes, and conduct comprehensive performance testing and reliability testing of semi-finished products and finished products, such as high temperature testing, low temperature testing, vibration testing, etc., to detect and solve potential quality problems in a timely manner.


In the process of use, users should also pay attention to some things to protect the mobile phone Avoid exposing your phone to high or low temperatures for a long time, such as not placing your phone in a car that is directly sunny or outside the cold. At the same time, pay attention to keep the phone dry, to avoid the use of mobile phones in a humid environment. In addition, regularly clean the dust inside the phone to avoid dust accumulation affecting heat dissipation and normal operation of the circuit.


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Witness the power of mobile phone reliability

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High and low temperature + soft pressure test after the display leakage


Mobile phone reliability is a comprehensive concept, affected by a variety of factors. By optimizing the design, strictly controlling the quality of the hardware and the correct protection of the user during use, we can effectively improve the reliability of the mobile phone and bring users a more stable and smooth experience.


Note: The above picture is partly derived from external channels, and is only for learning communication and reference use.


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After undergoing two reflow temperatures, OSP pads exhibited severe solderability issues during wave soldering. Reducing the reflow temperature resolved the solderability problems. This paper analyzes the failure causes and mechanisms of solderability defects on OSP pads and proposes improvement recommendations.
The Truth Behind the 30% Surge in FPC Lead-Free Failure Rates | The “Invisible Killer” of Consumer Electronics
A certain FPC exhibited routing shallowing at certain locations, with both the edges and central areas of the defective samples showing this phenomenon. This paper will conduct a systematic failure analysis to identify the root cause of routing shallowing in the FPC.
Silicone Exceeding Limits = EU Sales Ban? With Global Regulations Tightening, Is Your Product Compliant?
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Save Millions! Practical Tips for Avoiding Pitfalls in Metal Material Selection (Part 2)
In the previous article, “Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Material Selection for Electronics (Part 1),” we established a knowledge framework for metal material properties and applications, and outlined the core steps for scientific material selection. However, theory must be tested by practice. This article will focus on the practical aspects: How can advanced inspection technologies provide reliable data support for material selection decisions? How can performance and cost be skillfully balanced in projects? Real-world case studies will reveal the consequences of improper material selection and the solutions to address them.
Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Selection for Electronics (Part 1)
In electronic products, the selection of metal components directly impacts product performance, safety, and lifespan. From smartphone casings to aircraft engine blades, the scientific selection of metal materials stands as a core element in technological R&D. This article will explore the cost-effectiveness considerations in metal material selection in two parts, integrating laboratory testing techniques with engineering practice.
Flux compatibility issues with PCBA can actually lead to such severe consequences?!
A PCBA board for an audio product (using wave soldering) suffered burnout during operation. When using flux variant A, failure rates were high; after cleaning, the rate decreased slightly. Switching to flux variant B reduced the defect rate to zero. This paper will employ a series of professional testing and analytical methods to identify the root cause of the failure.
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