Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
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Parts keep breaking for no apparent reason? — Unravel the truth behind material failure through crack analysis!
Release date: 2025-05-16 00:00
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In material failure analysis, fracture is often a complex process, and finding the "starting point" of fracture - the fracture source area, just as the detective locks the first scene when solving the case. It not only reveals the initial trigger for fracture, but also provides important clues for preventing similar accidents and optimizing product design.



1:The fracturing source zone: Why is the “starting point” of fracture so important?

The break does not happen overnight, but begins to expand gradually from a weak point. The cleft source area is usually the result of a combination of internal defects, external stress concentration, or environmental factors. Accurately locate the source of the separation, can help engineers:

1, the source of retroactive failure: determine whether it is a material problem, process defects or a fracture caused by improper use;

2, improve product design: optimize the structure or material selection for weak links;

3、3, to prevent the recurrence of accidents: through targeted measures to avoid the recurrence of the same kind of fracture.



2"Talk": the typical breakage of the cleft source judgment

According to the characteristic pattern of the break of the polymer material, we can find the location of the cracking source like the interpretation of the password:


glyph

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The human character on the break, the direction of its "head" directly points to the crack source. This phenomenon stems from the direction of energy release during the crack expansion process.


parabolic

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The vertex of the parabola is the location of the starting source. This type of pattern is often broken when the material is hit by the load.


Direction of the river

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The small cracks of the line converge into a "river", and its flow direction points to a larger step or defect.


Point extension

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With the starting source as the center, the cracks expand outward in a radial form, similar to the "sun light", and the central point is the source.


In addition, share some of the bubbles or traces of chemical reagent erosion in some of the broken junctions we have encountered before, and see what differences exist with the above-mentioned cracking source break characteristics.


Undrying

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Chemical reagent soak crack road 1

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Chemical reagent soak cracked road two

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The meaning of the source judgment is not only to "find the problem", but also to "solve the problem". It is not only a bridge between failure and engineering practice, but also one of the core capabilities of material engineers.


Note: The above picture is partly derived from external channels, and is only for learning communication and reference use.


Interactive benefits

Analyze the crack source pattern in the picture and explain the basis for judgment.


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The answer was published on May 23, 2025.

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Customize the charging mouse pad or failure analysis case book!

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(Quickly forward the praise, one step closer to the grand prize!)


Relevant cases
Still failing despite meeting IPC standards? The OSP film thickness tolerance vulnerability overlooked by 90% of factories
After undergoing two reflow temperatures, OSP pads exhibited severe solderability issues during wave soldering. Reducing the reflow temperature resolved the solderability problems. This paper analyzes the failure causes and mechanisms of solderability defects on OSP pads and proposes improvement recommendations.
The Truth Behind the 30% Surge in FPC Lead-Free Failure Rates | The “Invisible Killer” of Consumer Electronics
A certain FPC exhibited routing shallowing at certain locations, with both the edges and central areas of the defective samples showing this phenomenon. This paper will conduct a systematic failure analysis to identify the root cause of routing shallowing in the FPC.
Silicone Exceeding Limits = EU Sales Ban? With Global Regulations Tightening, Is Your Product Compliant?
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Save Millions! Practical Tips for Avoiding Pitfalls in Metal Material Selection (Part 2)
In the previous article, “Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Material Selection for Electronics (Part 1),” we established a knowledge framework for metal material properties and applications, and outlined the core steps for scientific material selection. However, theory must be tested by practice. This article will focus on the practical aspects: How can advanced inspection technologies provide reliable data support for material selection decisions? How can performance and cost be skillfully balanced in projects? Real-world case studies will reveal the consequences of improper material selection and the solutions to address them.
Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Selection for Electronics (Part 1)
In electronic products, the selection of metal components directly impacts product performance, safety, and lifespan. From smartphone casings to aircraft engine blades, the scientific selection of metal materials stands as a core element in technological R&D. This article will explore the cost-effectiveness considerations in metal material selection in two parts, integrating laboratory testing techniques with engineering practice.
Flux compatibility issues with PCBA can actually lead to such severe consequences?!
A PCBA board for an audio product (using wave soldering) suffered burnout during operation. When using flux variant A, failure rates were high; after cleaning, the rate decreased slightly. Switching to flux variant B reduced the defect rate to zero. This paper will employ a series of professional testing and analytical methods to identify the root cause of the failure.
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