Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Dynamic performance test

The dynamic performance test simulates transient working conditions such as sudden load changes and flow fluctuations, tests the response speed, adjustment ability and stability of the CDU, and verifies its control performance in a dynamic environment.

Dynamic performance test
Dynamic performance test

Test Background


AI computing power loads have the characteristic of severe fluctuations. The CDU needs to respond quickly when the load suddenly changes, maintain stable temperature and pressure, and avoid the impact of chip temperature on computing power performance.

 

Test Introduction


The dynamic performance test simulates transient working conditions such as sudden load changes and flow fluctuations, tests the response speed, adjustment ability and stability of the CDU, and verifies its control performance in a dynamic environment.

 

Testing Objectives

 

Verify the temperature/pressure adjustment speed during sudden load changes

Evaluate the flow balance ability when multiple branches are in parallel

Test the vibration and noise levels during operation

Ensure the system stability under dynamic working conditions

 

Test Standards

 

T/CESA 1249.3-2023 Technical specification for cooling capacity distribution units

GB/T 34877 Performance evaluation of industrial process control systems

OCP CDU Dynamic response test guide

 

Applicable Products/Related Fields


Suitable for AI computing power centers, high-performance computing clusters, variable-load data centers, etc.

 

Test Content

 

Sudden load response test: Temperature recovery time under step load

Dynamic flow balance test: Flow fluctuations when multiple branches start and stop

Vibration and noise testing: Vibration amplitude and noise sound pressure under rated conditions

Control overshoot testing: Maximum deviation during the adjustment process

 

Project Advantages

 

Capable of simulating arbitrary load variation curves

High-dynamic-response data acquisition (sampling rate ≥ 100 Hz)

Provides dynamic response time constant and control parameter optimization suggestions

 

Laboratory Configuration

 

Programmable thermal load simulator

Dynamic response data acquisition system

Vibration tester (acceleration sensor)

Sound level meter (A-weighted)

 

FAQ
Q: What is the acceptable value for the CDU's response time to sudden load changes? A: Usually, when the system pressure changes by ±20%, the CDU is required to return to within ±5% of the set value within 10 seconds.

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