Thermal performance test

Test Background

The thermal performance of liquid-cooled plates directly determines whether the chip can operate at full load within a safe temperature range. As the power consumption of AI chips exceeds 1000W, thermal resistance and thermal distribution uniformity have become core performance indicators.

Test Introduction

The thermal performance test comprehensively evaluates the heat dissipation capacity of liquid-cooled plates under rated working conditions through heat transfer efficiency testing, thermal resistance testing, thermal distribution uniformity testing, and fit testing.

Testing Objectives

Measure the thermal resistance values of liquid-cooled plates at different flow rates

Evaluate the uniformity of surface temperature distribution

Verify whether the heat transfer efficiency meets the design target

Ensure good fit with the chip and minimize the contact thermal resistance

Test Standards

T/CESA 1249.1-2023 Cold plate technical specification

ASHRAE's test method for the thermal performance of liquid-cooled plates

Customer-defined thermal performance acceptance criteria

Applicable Products/Fields

Suitable for AI servers, high-performance computing, GPU/CPU liquid-cooled plates, IGBT liquid-cooled modules, etc.

Test Content

Thermal resistance test: Steady-state heat flow method, R = (Tc-Tl)/Q

Temperature distribution test: The surface temperature difference detected by the infrared thermal imager is ≤5°C

Heat transfer efficiency test: Heat dissipation power curves under different flow rates

Fit test: Detect contact uniformity by the pressure paper method

Project Advantages

High-precision heat source simulator (max. 2kW, accuracy ±0.5%)

Real-time temperature field monitoring via infrared thermal imager

Provides thermal resistance-flow rate curves and optimization suggestions

Laboratory Configuration

Thermal performance test system (including heat source, cold source, temperature control module)

Infrared thermal imager (FLIR T series)

Multi-point temperature acquisition system

Constant temperature cooling liquid circulation device

FAQ
Q: What is the thermal resistance requirement for the liquid cooling plate? A: For AI server cold plates, the thermal resistance is usually required to be ≤0.05°C·cm²/W, and the R value is <0.08°C/W under a 350W load.