Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Compatibility test

The compatibility test evaluates the chemical stability between the liquid-cooled plate material and the coolant through static/dynamic corrosion tests of the coolant and cleanliness tests, as well as the pollution risk of processing residues to the system.

Compatibility test
Compatibility test

Test Background


The liquid-cooled plate is immersed in the coolant for a long time. The chemical compatibility between the material and the coolant directly affects the service life and system cleanliness. Corrosion, precipitation, and blockage are the main failure modes of the liquid-cooled system.

 

Test Introduction


The compatibility test evaluates the chemical stability between the liquid-cooled plate material and the coolant through static/dynamic corrosion tests of the coolant and cleanliness tests, as well as the pollution risk of processing residues to the system.

 

Testing Objectives

 

Verify the corrosion rate of aluminum/copper materials in the coolant

Detect the amount of metal ion precipitation after long-term operation

Evaluate the cleanliness level of welding residues, processing debris, etc.

Ensure that there is no blockage or leakage caused by material compatibility

 

Test Standards

 

ASTM D1384 Coolant corrosion test

ASTM D2570 Fluid compatibility test

ISO 16232 Cleanliness determination

VDA 19 Cleanliness standard for the automotive industry

 

Applicable Products/Fields


Suitable for material selection and verification of various liquid-cooled plates, heat dissipation modules, and heat exchangers.

 

Test Content

 

Static corrosion test: Immerse at 85°C for 1000 hours and measure the corrosion rate

Dynamic corrosion test: Corrosion test under cyclic flow conditions

Cleanliness analysis: Analysis of the size and composition of particles in the flushing fluid

Metal ion release test: Detect ion concentration by ICP-OES

 

Project Advantages

 

Capable of simulating both static and dynamic corrosion conditions

Combined analysis using ion chromatography and ICP-OES

Cleanliness analysis covering particles, fibers and metal debris

 

Laboratory Configuration

 

Constant-temperature corrosion test chamber

Dynamic corrosion circulation test bench

Ion chromatograph, ICP-OES

Cleanliness analysis system (microscope + image analysis)

 

FAQ
Q: Will the aluminum cooling plate corrode in ethylene glycol solution?
A: Pure aluminum will corrode, but with surface passivation treatment and the addition of corrosion inhibitors in the coolant, the corrosion rate can be controlled within 0.1 mm/year.

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