Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Structural strength test

The structural strength test verifies the structural integrity of quick connectors under extreme pressure and abnormal forces through hydrostatic pressure holding tests, burst pressure tests, and separation safety tests.

Structural strength test
Structural strength test

Test Background


Quick connectors may be subjected to overpressure or accidental impacts under abnormal working conditions. Insufficient structural strength may lead to bursting and flying fragments, causing serious safety accidents.

 

Test Introduction


The structural strength test verifies the structural integrity of quick connectors under extreme pressure and abnormal forces through hydrostatic pressure holding tests, burst pressure tests, and separation safety tests.

 

Testing Objectives

 

Verify that the pressure resistance in the connected state is ≥3 times the working pressure

Determine the burst pressure limit and failure mode

Ensure reliable sealing at both ends in the disconnected state

Evaluate the separation safety in case of accidental pulling

 

Test Standards

 

GB/T 7939.2-2024 Test methods for quick-change connectors

ISO 18869-2017 Burst pressure test

OCP UQD structural strength requirements

 

Applicable Products/Fields


Suitable for UQD quick connectors, high-pressure quick connectors, pressure hot-plug connectors, etc. in liquid cooling systems.

 

Test Content

 

Hydrostatic pressure holding test: Hold the pressure at 1.5 times the working pressure for 5 minutes

Burst pressure test: Increase the pressure at a uniform speed until rupture and record the burst value

Pressure resistance test in the disconnected state: Pressurize both ends respectively to verify the sealing

Separation safety test: Control the disconnection force and leakage in case of accidental pulling

 

Project Advantages

 

High-pressure test system (maximum 20 MPa)

High-speed camera records the blasting process

Provides safety margin assessment and failure analysis

 

Laboratory Configuration

 

Hydrostatic test bench (0-20 MPa)

Burst test system (automatically records the pressure curve)

High-speed camera system

Protection device (prevent debris from splashing)

 

FAQ
Q: Why is a pressure test also required in the disconnected state? A: In the disconnected state, both ends of the connector are individually sealed. It is necessary to verify that it can still provide reliable sealing after disconnection when the pipeline is under pressure to prevent leakage.

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