Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Mechanical environment reliability

Through vibration tests, temperature cycle tests, damp-heat aging tests, and extreme temperature storage tests, the environmental stresses that quick connectors are subjected to during their entire life cycle are simulated to verify their environmental adaptability.

Mechanical environment reliability
Mechanical environment reliability

Test Background


Quick connectors need to withstand environmental stresses such as vibration, temperature changes, and humidity during transportation, installation, and operation. Insufficient mechanical environmental reliability may lead to connector loosening, seal failure, or material aging.

 

Test Introduction


Through vibration tests, temperature cycle tests, damp-heat aging tests, and extreme temperature storage tests, the environmental stresses that quick connectors are subjected to during their entire life cycle are simulated to verify their environmental adaptability.

 

Testing Objectives

 

Verify that there is no leakage or loosening under vibration conditions

Evaluate the impact of temperature cycles on sealing materials

Ensure that there is no corrosion or aging in a damp-heat environment

Verify the functional integrity after extreme temperature storage

 

Test Standards

 

IEC 60068-2-6 Vibration test

IEC 60068-2-14 Temperature change test

IEC 60068-2-30 Damp-heat test

GB/T 2423 Environmental test series standards

 

Applicable Products/Fields


Suitable for various types of liquid-cooled quick connectors, outdoor cabinet connectors, vehicle-mounted liquid-cooled connectors, etc.

 

Test Content

 

Vibration test: Random vibration from 5 to 2000 Hz, 20g

Temperature cycling test: Temperature cycling from -40°C to 85°C, 100 cycles

Wet-heat aging test: 85°C/85%RH, 1000 hours

Extreme temperature storage: Store at -40°C for 24 hours and at 75°C for 72 hours

 

Project Advantages

 

Capable of applying combined vibration and temperature stresses simultaneously

Compares changes in insertion and extraction forces and leakage rates before and after the test

Provides environmental adaptability rating and service life assessment

 

Laboratory Configuration

 

Electromagnetic vibration test system

High and low temperature alternating humidity test chamber

Insertion and extraction force tester (comparison before and after the test)

Helium mass spectrometer leak detector (comparison before and after the test)

 

FAQ
Q: Will the insertion and extraction forces change after wet-heat aging? A: The sealing material may swell or harden, resulting in changes in the insertion and extraction force, which need to be controlled within ±20%.

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