Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Reliability and durability testing

Through thermal shock, pressure pulse cycle, and vibration shock tests, the temperature, pressure, and mechanical stress that the liquid cooling plate will bear during its entire life cycle are simulated to verify its structural durability and performance stability.

Reliability and durability testing
Reliability and durability testing

Test Background


During long-term operation, liquid cooling plates need to withstand alternating stresses such as thermal shock, pressure pulses, and vibration shocks. Reliability testing can detect the risk of fatigue failure in advance to ensure a 10-year service life.

 

Test Introduction


Through thermal shock, pressure pulse cycle, and vibration shock tests, the temperature, pressure, and mechanical stress that the liquid cooling plate will bear during its entire life cycle are simulated to verify its structural durability and performance stability.

 

Testing Objectives

 

Verify the structural integrity and sealing performance under thermal cycling

Evaluate the fatigue impact of pressure pulses on welds and flow channels

Ensure the anti-vibration and anti-shock ability during transportation and operation

Predict the service life and failure mode of liquid cooling plates

 

Test Standards

 

T/CESA 1249.1-2023 Cold plate technical specification

IEC 60068-2-14 Temperature change test

ISO 6803 Pressure pulse test

GB/T 2423 Vibration and shock test

 

Applicable Products/Fields


Suitable for scenarios requiring long-term reliable operation, such as AI servers, vehicle-mounted liquid cooling, and industrial frequency converters.

 

Test Content

 

Thermal shock test: Temperature cycling from -40°C to 85°C, 500 cycles

Pressure pulse test: 0 to 1.5 times the working pressure, 100,000 cycles

Vibration test: Random vibration from 5 to 2000 Hz, 20g

Shock test: Half-sine wave, 50g, 11ms

 

Project Advantages

 

Capable of applying combined temperature and pressure stresses simultaneously

Real-time monitoring of leakage and pressure drop changes during testing

Provides fatigue life curves and failure analysis

 

Laboratory Configuration

 

High and low temperature shock test chamber (two-chamber method)

Pressure pulse test bench (0~5MPa, programmable waveform)

Electromagnetic vibration test system

Impact test table

 

FAQ
Q: Why is the pressure pulse test performed 100,000 times?
A: To simulate pressure fluctuations such as system start-stop and load changes, 100,000 cycles can cover a service life of more than 10 years.

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