Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Structural reliability test

The structural reliability test ensures the mechanical structural stability of the connecting device under complex working conditions through vibration and shock tests, thermal cycling, and life tests, combined with weld quality inspection.

Structural reliability test
Structural reliability test

Test Background


The connecting device needs to withstand vibration, shock, thermal cycling, and long-term fatigue stress during transportation, installation, and operation. Insufficient structural reliability may lead to serious failures such as weld cracking and joint loosening.

 

Test Introduction


The structural reliability test ensures the mechanical structural stability of the connecting device under complex working conditions through vibration and shock tests, thermal cycling, and life tests, combined with weld quality inspection.

 

Testing Objectives

 

Verify the sealing and structural integrity after vibration and shock

Evaluate the fatigue impact of thermal cycling on the weld and materials

Ensure that the insertion and extraction life of the quick-connect fitting is ≥ 5000 times

Detect weld defects and stress concentration areas

 

Test Standards

 

T/CESA 1249.2-2023 Technical specification for connection systems

IEC 60068-2 Vibration and shock standards

ISO 19879 Hydraulic pipeline fatigue test

GB/T 3323 Non-destructive testing of welds

 

Applicable Products/Fields


Suitable for liquid-cooled cabinets, water dividers, bellows, joint assemblies, etc.

 

Test Content

 

Vibration test: Random vibration from 5 to 2000 Hz, 20g

Shock test: Half-sine wave, 50g, 11ms

Thermal cycling test: Temperature cycling from -40°C to 85°C, 500 cycles

Insertion and extraction life test: A robot simulates 5000 times of insertion and extraction

Weld inspection: X-ray or ultrasonic flaw detection

 

Project Advantages

 

Capable of applying combined vibration and temperature stresses simultaneously

The insertion and extraction life testing supports simulation of hot-plugging under pressure

Provides weld quality rating and fatigue life evaluation

 

Laboratory Configuration

 

Electromagnetic vibration test system

Impact test table

High and low temperature alternating test chamber

Insertion and extraction life testing machine (maximum 500N)

Weld non-destructive testing equipment (X-ray/ultrasonic)

 

FAQ
Q: Why should the insertion and extraction life test be carried out under pressure? A: Hot-plugging under pressure is closer to the actual operation and maintenance scenario, which can verify the influence of internal pressure on the sealing structure and insertion and extraction force.

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