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Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
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Static performance test

The static performance test measures the heat transfer capacity,temperature/flow control accuracy and the energy consumption efficiency of the pump unit of the CDU under rated conditions to verify whether it meets the design specifications and hits the energy-efficiency targets.

Static performance test
Static performance test

Test Background


The heat transfer efficiency, control accuracy and pump unit efficiency of the CDU under steady-state conditions determine the basic performance of the liquid cooling system, which directly affects the temperature stability of the chip and the system energy consumption.

 

Test Introduction


The static performance test measures the heat transfer capacity, temperature/flow control accuracy and the energy consumption efficiency of the pump unit of the CDU under rated conditions to verify whether it meets the design specifications and hits the energy-efficiency targets.

 

Testing Objectives

 

Verify the heat exchange capacity of the heat exchanger under rated conditions

Evaluate the steady-state error of temperature and flow control

Measure the efficiency curves of the pump unit at different rotational speeds

Provide basic data for system energy efficiency optimization

 

Test Standards

 

T/CESA 1249.3-2023 Technical specification for cooling capacity distribution units

OCP CDU Performance Test Guide

ASHRAE Energy Efficiency Test Method for Liquid Cooling Systems

 

Applicable Products/Related Fields


Suitable for the selection and acceptance, R&D optimization, and energy-saving renovation evaluation of CDU in liquid-cooled data centers.

 

Test Content

 

Heat transfer efficiency test: Calculate the heat transfer amount by the enthalpy difference method on the primary/secondary side

Control accuracy test: The deviation between the set value and the actual value is ≤ ±0.5°C/±3%

Pump unit efficiency test: Power consumption and head curves at different flow rates

Static power consumption test: Energy consumption in standby mode

 

Project Advantages

 

High-precision sensor system (temperature ±0.1℃, flow rate ±0.5%)

Supports automatic testing at multiple operating points

Provides energy efficiency rating and optimization suggestions

 

Laboratory Configuration

 

Enthalpy difference method heat exchange test platform (150kW at maximum)

High-precision temperature/pressure/flow sensors

Power analyzer

Automated data acquisition system

 

FAQ
Q: What's the difference between the heat exchange efficiency and COP of CDU?
A: The heat exchange efficiency refers to the heat exchange capacity of the heat exchanger, and COP is the energy efficiency ratio (heat exchange/ power consumption). Both jointly determine the performance of CDU.

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Safety tests Dynamic performance test Reliability and durability test
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