Flow distribution performance test

Test Background

The water distributor needs to evenly distribute the coolant to each server node. Uneven flow will cause some chips to overheat and some to be too cold, seriously affecting the system's heat dissipation efficiency and the chip's service life.

Test Introduction

The flow distribution performance test focuses on examining the uniformity of the branch-circuit flow, conducts a pressure-drop test within the full flow range, and verifies the rationality of the Manifold's hydrodynamic design.

Testing Objectives

Measure the flow deviation of each branch circuit to ensure it is ≤±5%

Plot the pressure drop-flow curve over the full flow range

Evaluate the distribution stability under different inlet flows

Provide data support for the CDU flow control strategy

Test Standards

T/CESA 1249.2-2023 Technical specification for connection systems

ASHRAE test guide for flow distribution in liquid-cooled systems

Customer-defined uniformity acceptance criteria

Applicable Products/Fields

Suitable for water dividers of liquid-cooled cabinets, RCM, LCM, multi-branch distribution modules, etc.

Test Content

Flow uniformity test: Measure the flow deviation of multiple branches simultaneously

Pressure drop test: Inlet and outlet pressure drops under different total flow rates

Branch shut-off impact test: The impact of shutting down a single branch on other branches

Plotting of flow-pressure drop characteristic curve

Project Advantages

Multi-channel ultrasonic flowmeter for simultaneous measurement

Capable of simulating actual cabinet node distribution

Provides uniformity optimization suggestions (e.g. aperture adjustment)

Laboratory Configuration

Multi-channel flow test system (6-12 channels)

High-precision differential pressure sensor

Frequency conversion water pump and flow controller

Data Acquisition and Analysis Software

FAQ
Q: Why is the flow deviation ≤ ±5% important? A: Assuming the designed flow rate is 1L/min, a ±5% deviation means ±0.05L/min, corresponding to a heat dissipation capacity deviation of about ±5%, which can cause a temperature difference of 3-5°C in the chip.