Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service

Heat transfer performance test

The heat transfer performance test evaluates the thermophysical properties of the coolant at different temperatures through thermal conductivity testing, heat dissipation efficiency comparison tests and specific heat capacity tests, providing data support for system thermal design.

Heat transfer performance test
Heat transfer performance test

Test Background


The core function of coolant is to transfer heat. Heat transfer performance parameters such as thermal conductivity and specific heat capacity directly determine its heat dissipation capacity under the same flow rate, and are the key basis for system design and selection.

 

Test Introduction


The heat transfer performance test evaluates the thermophysical properties of the coolant at different temperatures through thermal conductivity testing, heat dissipation efficiency comparison tests and specific heat capacity tests, providing data support for system thermal design.

 

Testing Objectives

 

Determine the thermal conductivity of the coolant at different temperatures

Verify whether the specific heat capacity meets the design expectations

Compare the heat dissipation efficiency of different coolants

Provide thermophysical property data for the CDU flow control strategy

 

Test Standards

 

ASTM D2717 Liquid thermal conductivity test

ASTM E1269 Specific Heat Capacity Test

YD/T 3982-2021 Requirements for heat transfer performance

Customer-defined Comparative Test Method

 

Applicable Products/Fields


Suitable for the selection of various liquid cooling working fluids, ratio optimization, and performance comparison and verification.

 

Test Content

 

Thermal conductivity test: Measured by the hot wire method or the steady-state method

Specific heat capacity test: Differential Scanning Calorimetry (DSC)

Heat dissipation efficiency comparison: Comparison of temperature rises of different coolants under the same working conditions

Temperature-performance curve plotting: Changes in heat transfer performance at different temperatures

 

Project Advantages

 

High-precision thermal conductivity meter (±2% accuracy)

DSC specific heat capacity test (temperature range: -40°C to 100°C)

Provides a complete heat transfer performance data report

 

Laboratory Configuration

 

Thermal conductivity tester (hot wire method)

Differential scanning calorimeter (DSC)

Heat dissipation efficiency comparison test bench

Constant temperature circulating bath

 

FAQ
Q: How much higher is the thermal conductivity of water than that of ethylene glycol? A: At 25°C, the thermal conductivity of water is about 0.6 W/m·K, and that of ethylene glycol is about 0.25 W/m·K. Therefore, the heat transfer performance of pure water is better than that of ethylene glycol solution.

Online Service Enquiries
  • * Name:
  • * Email:
  • * Company:
  • Position:
  • * Tel:
  • City:
  • Consultation Content:
1. When you provide personal information to this website, we shall not disclose (share, sell or transfer) any of your personal information to third parties (including companies or individuals) without your prior consent, unless required by law or government mandate.
2. The information you provide will only be used to help us deliver a better service to you.
Email
marketing@mttlab.com
Business Consultation
Free Consultation
Report Inquiry
Back to Top
Contact Us
  • *Name:
  • *Contact:
  • *Email:
  • *Company/Organization/school:
  • *The location:
  • *Message information: