Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Reliability and durability test

The reliability and durability tests simulate various stresses that the valve will bear throughout its life cycle through opening-closing cycle life tests, thermal-cold cycle tests, damp-heat aging tests, vibration impact tests, and shell fatigue pressure-resistance tests.

Reliability and durability test
Reliability and durability test

Test Background


During long-term operation, valves need to withstand frequent opening and closing, pressure fluctuations, temperature changes, and vibration impacts. Insufficient reliability may lead to jamming, leakage, or control failure.

 

Test Introduction


The reliability and durability tests simulate various stresses that the valve will bear throughout its life cycle through opening-closing cycle life tests, thermal-cold cycle tests, damp-heat aging tests, vibration impact tests, and shell fatigue pressure-resistance tests.

 

Testing Objectives

 

Verify the mechanical durability of the valve during opening-closing cycles

Evaluate the impact of thermal-cold cycles on the sealing performance

Ensure no corrosion and no jamming in a hot and humid environment

Verify the functional integrity after vibration and shock

Determine the pressure fatigue life of the housing

 

Test Standards

 

IEC 60068-2 Environmental test standard

GB/T 2423 Vibration and shock test

ISO 19879 Hydraulic valve durability test

T/CESA 1249.2-2023 Reliability requirements

 

Applicable Products/Fields


Suitable for various liquid-cooled valves, solenoid valves, control valves, shut-off valves, etc.

 

Test Content

 

Opening and closing cycle life test: 5000-10000 opening and closing cycles

Thermal cycling test: Temperature cycling from -40°C to 85°C, 100 cycles

Wet-heat aging test: 85°C/85%RH, 1000 hours

Vibration and shock test: Vibration from 5 to 2000Hz, 50g shock

Housing fatigue pressure resistance: Pressure pulse from 0 to 1.5 times the working pressure, 100,000 cycles

 

Project Advantages

 

Capable of applying combined stresses of temperature, pressure and vibration simultaneously

Real-time monitoring of leakage and action time during testing

Provides service life prediction and failure analysis

 

Laboratory Configuration

 

Opening and closing life test bench

High and low temperature alternating humidity test chamber

Electromagnetic vibration test system

Pressure pulse test bench

Leakage test system (comparison before and after the test)

 

FAQ
Q: How to evaluate the coil life of the solenoid valve? A: Evaluate the insulation life and action reliability of the coil through continuous power-on and power-off cycle tests combined with temperature rise tests.

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