Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Reliability and durability test

The reliability and durability tests, including temperature cycling test, long-term stability test, bubble influence test, and medium viscosity influence test, simulate the long-term performance of the sensor under real working conditions.

Reliability and durability test
Reliability and durability test

Test Background


During long-term operation, sensors need to withstand environmental stresses such as temperature changes, medium impact, and bubble interference. Insufficient reliability may lead to drift, failure, or false alarms, affecting the intelligent level of the system.

 

Test Introduction


The reliability and durability tests, including temperature cycling test, long-term stability test, bubble influence test, and medium viscosity influence test, simulate the long-term performance of the sensor under real working conditions.

 

Testing Objectives

 

Verify the accuracy retention after temperature cycling

Evaluate the zero and span drift during long-term operation

Detect the influence of bubbles on the measurement stability

Ensure the measurement accuracy under different medium viscosities

 

Test Standards

 

IEC 60068-2 Environmental test standard

GB/T 2423 Temperature change test

ISO 12242 Bubble influence test for ultrasonic flow meters

Customer-defined long-term stability requirements

 

Applicable Products/Fields


Suitable for long-term reliability verification of temperature, pressure, flow, and liquid leakage sensors in liquid cooling systems.

 

Test Content

 

Temperature cycling test: Temperature cycling from -40°C to 85°C, 100 cycles

Long-term stability test: Continuous operation for 1000 hours under rated conditions

Bubble influence test: Measurement error in a gas-containing medium

Medium viscosity influence test: Comparison of media with different viscosities

Accuracy comparison before and after aging

 

Project Advantages

 

Capable of simulating actual operating environmental stresses

Real-time monitoring of drift trends

Provides service life estimation and replacement recommendations

 

Laboratory Configuration

 

High and low temperature alternating test chamber

Long-term operation monitoring platform

Bubble generation and control system

Circulation system for media with different viscosities

Standard source (regular calibration)

 

FAQ
Q: How much is the flow sensor affected by bubbles? A: Bubbles can cause the attenuation or reflection of ultrasonic signals, leading to measurement fluctuations or even failures. It is required to avoid bubbles from entering the measurement section during system design.

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