Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Compatibility test

The compatibility test verifies the comprehensive matching of the valve in the liquid cooling system through the static corrosion test of the coolant and the flow linkage control test of the pump-sensor-valve.

Compatibility test
Compatibility test

Test Background


The seals inside the valve and the valve body material need to be compatible with the coolant for a long time and need to work in coordination with the pump and sensors. Insufficient compatibility may cause corrosion, swelling, or inaccurate control.

 

Test Introduction


The compatibility test verifies the comprehensive matching of the valve in the liquid cooling system through the static corrosion test of the coolant and the flow linkage control test of the pump-sensor-valve.

 

Testing Objectives

 

Verify the compatibility of the valve body and sealing materials with the coolant

Evaluate the response consistency of the valve in dynamic control

Ensure there are no abnormalities when working in coordination with the pump and sensor

Verify the compatibility of communication and control protocols

 

Test Standards

 

ASTM D2570 Coolant compatibility test

GB/T 17213 Control valve linkage test

Modbus/I2C communication protocol compatibility specification

Customer-defined linkage control requirements

 

Applicable Products/Fields


Suitable for the compatibility verification of various valves in the liquid cooling system during CDU integration.

 

Test Content

 

Material compatibility test: Immersion corrosion of metal/non-metal materials

Seal swelling test: Changes in volume and hardness

Linkage control test: Form a closed-loop control with the pump and sensor

Flow stability test: Flow fluctuations under PID regulation

 

Project Advantages

 

Covers multi‑dimensional compatibility across materials, control systems and overall system

Capable of simulating actual CDU control logic

Provides compatibility evaluation and control parameter optimization recommendations

 

Laboratory Configuration

 

Constant-temperature soaking test chamber

Valve performance test platform (with control signal interface)

Programmable Logic Controller (PLC)

Flow/pressure/temperature synchronous monitoring system

 

FAQ
Q: How do solenoid valves and control valves cooperate in a liquid-cooling system? A: The shut-off valve is used for fault isolation, and the control valve is used for flow control. The two cooperate to achieve system redundancy and precise regulation.

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