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Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
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Electrical performance test

The electrical performance test verifies the adaptability of sensors in electrical safety and electromagnetic environments through insulation resistance tests, withstand voltage tests, power consumption tests, and EMC tests.

Electrical performance test
Electrical performance test

Test Background


Sensors (temperature, pressure, flow, and liquid leakage sensors) are the foundation of the intelligent monitoring of the liquid cooling system. Their electrical performance directly affects the signal transmission quality and system reliability. Electrical failures may lead to false alarms or control failures.

 

Test Introduction


The electrical performance test verifies the adaptability of sensors in electrical safety and electromagnetic environments through insulation resistance tests, withstand voltage tests, power consumption tests, and EMC tests.

 

Testing Objectives

 

Verify the electrical insulation strength of sensors

Ensure that the withstand voltage capacity meets the application requirements

Measure the power consumption of sensors and evaluate the system load

Verify electromagnetic compatibility and anti-interference ability

 

Test Standards

 

EN/UL 62368-1 Electrical safety requirements

IEC 61000 EMC test standard

GB/T 17626 Electromagnetic compatibility test methods

Customer-defined electrical performance requirements

 

Applicable Products/Fields


Suitable for temperature sensors, pressure sensors, flow sensors, liquid leakage sensors, etc. in liquid cooling systems.

 

Test Content

 

Insulation resistance test: The insulation between the sensor and the enclosure is ≥100 MΩ

Withstand voltage test: Withstand a voltage of 500V-1500V for 1 minute without breakdown

Power consumption test: Current consumption under the operating voltage

EMC test: Electrostatic discharge, radiated immunity, electrical fast transient/burst

 

Project Advantages

 

Comprehensive electrical safety and EMC test capabilities

Capable of simulating actual electromagnetic environments

Provides complete electrical performance reports

 

Laboratory Configuration

 

Safety comprehensive analyzer

DC power analyzer

ESD generator

RF radiated immunity test system (outsourced or in cooperation)

 

FAQ
Q: What problems can poor insulation of the sensor cause? A: Poor insulation may cause signal interference and measurement drift. In severe cases, it may lead to leakage and short-circuit, affecting the entire control system.

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Further reading
Accuracy and response characteristic test Reliability and durability test Compatibility test
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