CN +86-400-850-4050
Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Solder Joint Reliability
Solder Joint Quality Assessment
Numerical Simulation Analysis
UL Certification Consultation
High Temperature and High Humidity Test
Corrosion Resistance Test
Particulate Cleanliness
Foreign Object Analysis
Tin Whiskers Observation
Ionic Cleanliness
Temperature Cycling Test
Slicing Analysis
Intermetallic Compound
PCB Stress-Strain Test
PCBA Solder Joint Quality Assessment
Dyeing Test
PCBA Welding Process Qualification
Solder Mask
PCB Physical Property Test
Visual Inspection
Mechanical strength of solder joints
Plated Through-Hole Test
Dynamic thermal deformation (curvature)
TMA Test
Thermogravimetric Analysis
Differential Scanning Calorimeter
Thermal Conductivity
Combustion Test
Principal Component Analysis of Insulation Substrate
Mechanical Property Testing
Thermal Stress Test
Dimensional Measure
ECM/CAF Test
PCB Hazardous Substance Detection
PCB Electrical Performance
Vibration Test
Copper Purity Of Conductor
Solderability Test
Control Of Incoming Electronic Materials
Reliability Assessment Of Electronic Accessories
Compatibility Assessment Of Electronic Accessories And Processes
Selection And Evaluation Of Electronic Accessories
Cleaning Agent Test
Flux Test
Three-Proof Paint Test
Red Phosphorus Detection
Siloxane Test
ELV Test
Phthalate
Asbestos
Volatile Organic Compounds
Polycyclic Aromatic Hydrocarbons
Toxic Substances Control Act
PFAS
POPs Control
California 65
Registration, Evaluation, Authorization, and Restriction of Chemicals
RoHS Regulations
Halogen/Sulfur Content
Shear/Torsion Test
Microscopic Metallographic Analysis
Wear Test
High-Temperature Mechanics
Peel Strength Test
Surface Roughness
Non-metallic inclusions
Grain Size
Macroscopic Metallographic Analysis
Welding Residual Stress
Brand Identification/Recommendation
Electrical Properties (metal)
Depth Measurement Of Carburizing/Nitriding/Hardening Layer
Melting Point Test（Metal）
Hardness Test
Principal Component Analysis
Total Component Analysis
Material Thermal Analysis
Phase Analysis
Fiberglass Content
Ash Content
Flame Retardant Test
Specific Heat Capacity Test
Thermal Expansion Coefficient Test
Glass Transition Temperature
Melting Point Test (Polymer)
Fatigue Test
Impact/Toughness Test
Bending Compression Test
Tensile Test
Temperature and Humidity Cyclic
Surface Insulation Resistance
Rapid Temperature Change Test
The Three-Combination Test
Drop Test
Mechanical Shock Test
Dust Test
Salt Spray Corrosion Test
Flow Gas Corrosion Test
Thermal Shock Test
High Temperature / Low Temperature Storage
Total Bacterial Count
Total Dissolved Solids
pH Value
Conductivity
Total Organic Carbon
Elemental Analysis
Ionic Analysis
Purified Water Physicochemical Analysis
Microscopic Analysis
X-ray Diffraction
Optical Microscope
Time of Flight Secondary Ion Mass Spectrometry
Dynamic Secondary Ion Mass Spectrometry
X-ray Photoelectron Spectroscopy
EBSD
AFM
Nanoindentation/Nanohardness
Basic Performance Test of Automotive Thermal Management
Automotive Electronic Reliability Testing
PCBA/PCB Testing and Analysis Services
Automotive Electronic Component Test
Connector End Plate Test
Mechanical Testing Of Connectors
Connector Environmental Testing
Electrical Performance Testing Of Connectors
Terminal Mechanical Performance Testing
Mechanical Reliability
Environmental Reliability
Electrical Performance Reliability
Component Fatigue Life Test
Automotive Chip Electronic Reliability Testing
Corrosion Resistance Test
Component Analysis
Particulate Cleanliness Test
Gravel Impact Test
Abrasion Test
Nondestructive Test
Non-Metallic Materials
Metal Material
Coating/Plating Detection
Performance testing of automotive materials
Automotive Pipeline Performance Test
ELV Test
Cells Contact System
Transmission Electron Microscopy
Fault Diagnosis Test
Multi Functional Solder Joint Test
Industrial CT
Focused Ion Beam
Cross-section Polisher
Optical Beam Induced Resistance Change
Thermal EMMI
EMMI Localization
Glass Passivation Layer
Delayering Test
Cratering Test
Sample Preparation Microscopy
Internal Visual Inspection
Laser Decapsulation
Strength Test
External Visual Inspection
C-SAM
SEM
AES
Excitation Test
Reproduction Test
CDM ESD
Human Body Model Electrostatic Discharge
X-RAY
Board-Level Failure Analysis
Whole-Machine Failure Analysis
Hardware White-Box Testing Projects
Component Failure Analysis
Sealing Device
Capacitive MLCC
Expired Material – IC
Counterfeit/Refurbished Device
Plastic-encapsulated Devices
Human Body Model Electrostatic Discharge
Latch-up
Chip Aging and Lifetime Test
Chip Reliability Hardware Design Services
Chip Packaging Reliability Environmental Tests
Automotive Chip Electronic Reliability Testing
Evaluation Of New Materials/New Processes
Hardware White-Box Testing Projects
Localization Device Certification
EHMS
Mixed Oil Analysis
Component Analysis
Debris Analysis
Oil Filter Analysis
Oil Quality Testing
Reliability test
Corrosion Resistance Test
Nondestructive Testing
Scanning Electron Microscopy
Foreign Object Analysis
Bending Test
Long-term Creep Test
Shear Test
Hardness Test
Compression Test
Advanced Material Characterization
Destructive physical Analysis
Electrical performance test
Accuracy and response characteristic test
Reliability and durability test
Compatibility test
Safety test
Functional and performance test
Reliability and durability test
Compatibility test
Safety test
Function and energy efficiency test
Reliability and durability test
Compatibility test
Physicochemical property test
Heat transfer performance test
Material compatibility test
Environmental adaptability/aging test
Safety performance test
Sealing performance test
insertion and extraction life and mechanical performance
Mechanical environment reliability
Structural strength test
Compatibility test
Sealing and pressure resistance test
Flow distribution performance test
Structural reliability test
Interface adaptability and chemical tests
Safety tests
Thermal performance test
Reliability and durability testing
Compatibility test
Safety tests
Static performance test
Dynamic performance test
Reliability and durability test
Thermal performance test
Reliability test
Safety test
Energy efficiency test
Compatibility test
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service
Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.
Didn't find what you were looking for?
Consult a professional engineer immediately for your service

3 Minutes to Quickly Distinguish Fracture Patterns

Release date： 2025-04-16 00:00
Share to：

Plastic is the most widely used, the most widely used polymer materials, but also the most failure type, of which the fracture form is the most common failure mode of plastic. How to quickly determine the fracture mode and locate the starting and forming source is the key to optimizing material design and improving product reliability. This paper combines laboratory analysis experience to analyze the judgment method of fracture mode to help engineers accurately diagnose the root cause of failure.


Three Breaking Patterns

· Fragile fractures

The brittle fracture resin is not significantly plasticized on the pattern, that is, the resin has no obvious traces of elongation, as follows:

Image

Fragile fracture is usually not easy to detect before breaking, fracture absorption energy is small, brittle fracture may be caused by aging, stress residue, speed impact and so on.

· Resilience fractures

Resilience fracture is relative to brittle fracture, the resin has been yielding, plastic deformation, there are obvious traces of elongation, as follows:

Image

The toughness fracture usually absorbs more energy during the fracture process, which is higher than the material yield stress, and is an external force overload fracture.


Rigidity Fracture (Left) & Fragile Fracture (Right)

Comparison chart

Image


· Fatigue fractures

Fatigue fracture lines are usually parallel to each other, with regular spacing, and vertical stripes with crack expansion direction, similar to the beach pattern layer by layer. The following figure:

Image

Fatigue fracture is usually the brittle fracture of the material under the action of alternating stress (circulation load).


Fracture pattern comparison table

Image


Previous entry：Tariff Surge + TSCA Crackdown: A Double Whammy! In-Depth Analysis of Regulatory Red Lines and Risk Mitigation Strategies
Next item：Essential Insights into Electronic Process Failure Analysis | Unveiling Technical System Case Studies
Relevant cases
Still failing despite meeting IPC standards? The OSP film thickness tolerance vulnerability overlooked by 90% of factories
After undergoing two reflow temperatures, OSP pads exhibited severe solderability issues during wave soldering. Reducing the reflow temperature resolved the solderability problems. This paper analyzes the failure causes and mechanisms of solderability defects on OSP pads and proposes improvement recommendations.
The Truth Behind the 30% Surge in FPC Lead-Free Failure Rates | The “Invisible Killer” of Consumer Electronics
A certain FPC exhibited routing shallowing at certain locations, with both the edges and central areas of the defective samples showing this phenomenon. This paper will conduct a systematic failure analysis to identify the root cause of routing shallowing in the FPC.
Silicone Exceeding Limits = EU Sales Ban? With Global Regulations Tightening, Is Your Product Compliant?
Siloxanes are a class of organosilicon compounds containing Si-O-Si bonds, widely used in rubber, detergents, polishes, adhesives, sealants, and other fields. Due to the environmental and health risks associated with certain siloxanes, numerous countries and regions worldwide have enacted regulations to control their use.
Save Millions! Practical Tips for Avoiding Pitfalls in Metal Material Selection (Part 2)
In the previous article, “Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Material Selection for Electronics (Part 1),” we established a knowledge framework for metal material properties and applications, and outlined the core steps for scientific material selection. However, theory must be tested by practice. This article will focus on the practical aspects: How can advanced inspection technologies provide reliable data support for material selection decisions? How can performance and cost be skillfully balanced in projects? Real-world case studies will reveal the consequences of improper material selection and the solutions to address them.
Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Selection for Electronics (Part 1)
In electronic products, the selection of metal components directly impacts product performance, safety, and lifespan. From smartphone casings to aircraft engine blades, the scientific selection of metal materials stands as a core element in technological R&D. This article will explore the cost-effectiveness considerations in metal material selection in two parts, integrating laboratory testing techniques with engineering practice.
Flux compatibility issues with PCBA can actually lead to such severe consequences?!
A PCBA board for an audio product (using wave soldering) suffered burnout during operation. When using flux variant A, failure rates were high; after cleaning, the rate decreased slightly. Switching to flux variant B reduced the defect rate to zero. This paper will employ a series of professional testing and analytical methods to identify the root cause of the failure.
Email
marketing@mttlab.com
Business Consultation
Free Consultation
Report Inquiry
Back to Top
Contact Us
  • *Name：
  • *Contact：
  • *Email：
  • *Company/Organization/school：
  • *The location：
  • *Message information：
Email：
marketing@mttlab.com

  • Maxin Testing Laboratory

    Learn more about our company

  • Electronic Manufacturing Information Hub

    See more exciting case studies

  • Video Channel

    Watch more exciting videos

  • Follow us：
Buildings A1, A3, and A5, Peking University Science and Innovation Park, Songbai Road, Bao'an District, Shenzhen
Building 3, Xinyao Valley, 415 Changyang Street, Suzhou Industrial Park, Suzhou City
1st Floor, Building 4, No. 39 Anzhi Street, Suzhou Industrial Park, Suzhou City
All rights reserved by Shenzhen Meixin Testing Technology Co., LTD. - Third-party Material Testing
粤ICP备12047550号-2 | Site map | Privacy Policy | Legal Statement |