








On May 15, 2025, the 2025 Global Automotive Power Semiconductor Summit (GAPS), themed “Powering the Automotive Era, Leading the Future of Semiconductors,” grandly opened in Hangzhou. Shenzhen Meixin Testing Technology Co., Ltd. (hereinafter referred to as “Meixin Testing”) was invited to attend the summit and deliver a keynote speech. Gathering with global experts in automotive-grade semiconductors, corporate representatives, and partners across the industry chain, attendees jointly explored technological trends and market demands in new energy vehicles, witnessed innovative achievements, and collaborated to advance industrial cooperation and technological advancement.
Focus on Industry Trends: Driving Reliability Enhancement

At this summit, Cui Fengzhou, General Manager of the Semiconductor Division at Maxim Testing, delivered a keynote speech titled “Reliability Evaluation of Automotive Electronic Components.”



Through practical case studies of SiC diode overvoltage breakdown, MOSFET EOS burnout, and bond breakage, Mr. Cui revealed the root causes of failure in automotive electronic components and emphasized the importance of end-to-end process control.
Industry Recognition of Professional Excellence: Awarded the Outstanding Supplier Award

Additionally, Meixin Testing was honored as an Outstanding Supplier of Automotive-Grade Power Semiconductor Technical Services at this summit. This recognition stands as a testament to Meixin Testing's professional expertise in the semiconductor testing field.

Over the years, Meixin Testing has built a strong reputation in the semiconductor testing field through its professional technical team, advanced equipment, and high-quality testing services. This award not only recognizes Meixin Testing's past efforts but also serves as an incentive for us to continue driving technological innovation in semiconductor testing and promoting high-quality development within the industry.
Demonstrating Full-Chain Service Capabilities: Covering the Entire Semiconductor Lifecycle

At the summit, Meixin Testing showcased the semiconductor division's profound technical expertise, robust service capabilities, and comprehensive coverage across the entire semiconductor industry chain. Starting from the industry's source—chip design—the division spans critical stages including wafer foundry/manufacturing, packaging or testing, soldering assembly (SMT), and final assembly/product verification, ultimately extending to the provision of end-use solutions.

Technical engineers from Meixin Testing, armed with deep technical expertise, and sales personnel backed by extensive market experience, jointly provided comprehensive technical services and solution presentations to visiting exhibitors seeking consultation. This drew attendees to linger at the booth, engage in active discussions and negotiations, demonstrating high recognition for Meixin Testing.

面向未来,我们将秉持精益求精的专业态度,深度聚焦半导体企业检测服务需求。以更优质的服务、精湛的技术满足客户日益多样化的需求。打造具有高精度、高效能、高品质的新质检测服务企业,为半导体企业研发制造精准赋能。
