Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Maxim Testing Honored as “Outstanding Supplier of Automotive-Grade Power Semiconductor Technical Services,” Driving Semiconductor Reliability Enhancement!
Release date:2025-05-16 00:00
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On May 15, 2025, the 2025 Global Automotive Power Semiconductor Summit (GAPS), themed “Powering the Automotive Era, Leading the Future of Semiconductors,” grandly opened in Hangzhou. Shenzhen Meixin Testing Technology Co., Ltd. (hereinafter referred to as “Meixin Testing”) was invited to attend the summit and deliver a keynote speech. Gathering with global experts in automotive-grade semiconductors, corporate representatives, and partners across the industry chain, attendees jointly explored technological trends and market demands in new energy vehicles, witnessed innovative achievements, and collaborated to advance industrial cooperation and technological advancement.


Focus on Industry Trends: Driving Reliability Enhancement


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At this summit, Cui Fengzhou, General Manager of the Semiconductor Division at Maxim Testing, delivered a keynote speech titled “Reliability Evaluation of Automotive Electronic Components.”



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Through practical case studies of SiC diode overvoltage breakdown, MOSFET EOS burnout, and bond breakage, Mr. Cui revealed the root causes of failure in automotive electronic components and emphasized the importance of end-to-end process control.


Industry Recognition of Professional Excellence: Awarded the Outstanding Supplier Award


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Additionally, Meixin Testing was honored as an Outstanding Supplier of Automotive-Grade Power Semiconductor Technical Services at this summit. This recognition stands as a testament to Meixin Testing's professional expertise in the semiconductor testing field.


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Over the years, Meixin Testing has built a strong reputation in the semiconductor testing field through its professional technical team, advanced equipment, and high-quality testing services. This award not only recognizes Meixin Testing's past efforts but also serves as an incentive for us to continue driving technological innovation in semiconductor testing and promoting high-quality development within the industry.


Demonstrating Full-Chain Service Capabilities: Covering the Entire Semiconductor Lifecycle


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At the summit, Meixin Testing showcased the semiconductor division's profound technical expertise, robust service capabilities, and comprehensive coverage across the entire semiconductor industry chain. Starting from the industry's source—chip design—the division spans critical stages including wafer foundry/manufacturing, packaging or testing, soldering assembly (SMT), and final assembly/product verification, ultimately extending to the provision of end-use solutions.


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Technical engineers from Meixin Testing, armed with deep technical expertise, and sales personnel backed by extensive market experience, jointly provided comprehensive technical services and solution presentations to visiting exhibitors seeking consultation. This drew attendees to linger at the booth, engage in active discussions and negotiations, demonstrating high recognition for Meixin Testing.




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面向未来,我们将秉持精益求精的专业态度,深度聚焦半导体企业检测服务需求。以更优质的服务、精湛的技术满足客户日益多样化的需求。打造具有高精度、高效能、高品质的新质检测服务企业,为半导体企业研发制造精准赋能。

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