Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Troubleshooting by Diagram: How Many of These Failure Modes Have You Seen?
Release date: 2025-03-11 00:00
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In modern industry, polymer materials are widely used for their lightweight, corrosion-resistant, easy processing and other properties. However, the problem of material failure is like a "sword of Damocles", which can threaten the safety and life of the product at any time. How to see the essence through the phenomenon, to find the root cause of failure? This article will show you the typical failure modes of polymer materials.



Plastic failure

Plastic failure often starts with minor defects that eventually lead to catastrophic destruction.

Challenge your eyes! Guess which of the following image is the failure mode?

Image


Click on the blank space below to see the answer


A: Fractured, B: Cracked

C: breakdown, d: corrosion



Adhesive failure

The structure is unstable and the security risks have increased sharply.

Challenge your eyes! Guess which of the following image is the failure mode?

Image


Click on the blank space below to see the answer


A: shedding, b: liquefaction

C: Color change, d: softer



Failure of coating

Coating failure not only affects performance, but also can cause safety hazards.

Challenge your eyes! Guess which of the following image is the failure mode?

Image


Click on the blank space below to see the answer


A: Bubble, B: change of color

C: wrinkled, d: fall off



Rubber failure

Rubber is prone to complex failure under dynamic conditions.

Challenge your eyes! Guess which of the following image is the failure mode?

Image

Click on the blank space below to see the answer


A: Cracking, B: frosting

C: Corrosion, D: Discoloration


Summary: The failure analysis of polymer materials is not only a technical problem, but also a systematic risk management. Only in-depth understanding of material characteristics, environmental interaction and use scenarios can achieve "no disease prevention" in the design, production and maintenance of the whole cycle.

The next time you face an anomaly from the material, you may wish to ask more: What kind of failure password is hidden behind this?  


Pay attention to us and get more in-depth analysis of materials science!  

Ask


Fire eyes, look at the big challenge

What is the following image failure mode?

Image

The answer was published on March 18, 2025.

And smoked 3 fans sent out a case book of failure analysis!



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Electronic process failure analysis

Senior expert decryption failure analysis of the whole process

Image


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After undergoing two reflow temperatures, OSP pads exhibited severe solderability issues during wave soldering. Reducing the reflow temperature resolved the solderability problems. This paper analyzes the failure causes and mechanisms of solderability defects on OSP pads and proposes improvement recommendations.
The Truth Behind the 30% Surge in FPC Lead-Free Failure Rates | The “Invisible Killer” of Consumer Electronics
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In the previous article, “Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Material Selection for Electronics (Part 1),” we established a knowledge framework for metal material properties and applications, and outlined the core steps for scientific material selection. However, theory must be tested by practice. This article will focus on the practical aspects: How can advanced inspection technologies provide reliable data support for material selection decisions? How can performance and cost be skillfully balanced in projects? Real-world case studies will reveal the consequences of improper material selection and the solutions to address them.
Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Selection for Electronics (Part 1)
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Flux compatibility issues with PCBA can actually lead to such severe consequences?!
A PCBA board for an audio product (using wave soldering) suffered burnout during operation. When using flux variant A, failure rates were high; after cleaning, the rate decreased slightly. Switching to flux variant B reduced the defect rate to zero. This paper will employ a series of professional testing and analytical methods to identify the root cause of the failure.
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